Bonding & Assembly Process
 Pick & Place System |
 Self-assembly Multichip Bonder |
Self-assembly - Pick & Place System - Multichip Bonder |
 Chip Bonder (C2C) |
 FC Bonder (C2W) |
 Aligner& Bonder (W2W/C2W) |
Stacking - Chip Bonder (C2C) - FC Bonder (C2W) - Aligner& Bonder (W2W/C2W) |
 Vacuum Mold & UF System |
 Lift-off Resist Remover |
Assembling - Vacuum Mold & UF System - Lift-off Resist Remover |