One-Stop Solution from Concept, Design, Fabrication & Testing

State-of-the-art technologies

• resident engineering expertise in design, process / integration  technology and packaging / assembly
• 200mm and 300mm 3D process engineering lines and advanced technology platforms
  • design / layout / mask making
  • wafer / chip thinning
  • forming TSV on chip / wafer (front side / backside TSV)
  • Cu rerouting
  • forming u-bumps on chip / wafer
  • chip / wafer stacking
• Complete material and failure analysis, and reliability testing

3D stacking LSIs prototype manufacturing service

• lower cost, shorten TAT prototyping of proof of concepts using commercial/customized 2D chips
• die-level 3D hetero-integration with backside TSV technology

Support your small-volume, special customized 3D productions

• base-line process set-up for the pilot production
• facilitate your product development

Development innovative 3D stacking technologies for creative 3D products and applications

Supply IP and special customized TEG wafers for process-induced reliability characterization