200mm/300mm Silicon-Based TSV Fab Process Modules

Temporary Bonder

Wafer Debonder

Temporary Bonding  - Bonder  - Debonder

Edge Trimming Dicing Saw

Grinder Polisher

Thinning - Edge Trimming Dicing Saw - Grinder Polisher

i-line Stepper with IR Align

Developer

Lithography - i-line Stepper with IR Align - Developer

Si Deep RIE

Asher

Via Etching - Si Deep RIE - Asher

TSV Liner CVD

TSV Liner CVD  - PE-CVD  - O3-CVD

High-aspect-ratio Sputter

Metal Etcher

Electroplater

Metallization - High-aspect-ratio Sputter - Metal Etcher - Electroplater